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Boosting Performance in Storage Server Connectors
Designers of high-performance storage servers – particularly in real-time environments – achieve the best data transfer rates through a strategy of maximizing signal integrity and minimizing latency. This optimization effort leads to the dual challenges of increasing storage density within confined spaces and the significant thermal loads that come with higher storage capacities.
In order to resolve these issues, engineers can leverage high-speed interfaces such as Non-Volatile Memory Express (NVMe), Peripheral Component Interconnect Express (PCIe), Serial Attach SCSI (SAS) and 100Gbps Ethernet, along with advanced interconnects such as NVMe over Fabrics (NVMe-oF) and direct-attached storage solutions. These technologies boost data transfer speeds and ensure low-latency pathways to maintain real-time data access. Future-proof storage solutions that optimize PCB space utilization and incorporate advanced thermal management techniques allow systems to scale without jeopardizing hardware performance.
Molex helps designers overcome these challenges with high-speed server storage interconnects engineered for superior signal integrity, meeting the latest industry performance standards like PCIe Gen 5 and Gen 6. Versatile form and function provide the flexibility needed to maximize space without compromising performance. Featuring low mated heights and reduced footprints to enhance airflow and heat dissipation, Molex storage server connectivity solutions deliver superior thermal management.
Featured Products
High-Speed Internal I/O Connectors
When designing internal I/O connectivity solutions for storage servers, engineers encounter significant hurdles in preserving signal integrity and managing bandwidth. Reliable data transmission depends on the use of high-grade components, effective EMI shielding and sophisticated signaling methods. By reducing signal degradation, precision manufactured I/O connectors from Molex offer a dependable solution for high-performance storage server applications.
PCIe Gen 4 16 Gbps |
PCIe Gen 5 32 Gbps |
PCIe Gen 6 64 Gbps |
PCIe Gen 7 128 Gbps |
Standard | |
---|---|---|---|---|---|
NextStream Connector System | x | x | SFF-TA-1035 | ||
NearStack PCIe Connector System | x | x | SFF-TA-1026 | ||
NearStack HD Connector System | x | x | |||
KickStart Connector System | x | x | SFF-TA-1036 | ||
Multi-Trak I/O Connectors | x | x | SFF-TA-1033 | ||
SAS Connector System | x | x | SFF-TA-8639 | ||
Sliver Edge Card Connectors | x |
x |
SFF-TA-1002 |
Backplane Connectors
As data rates soar beyond 25Gbps per lane and latency requirements become stricter, backplane connectors must keep pace with the latest industry standards including PCIe 4.0, PCIe 5.0 and the upcoming PCIe 6.0. Molex addresses these challenges with innovative backplane connectors that offer superior performance, minimizing insertion loss while maintaining optimal signal integrity. Scalable and modular designs provide the flexibility needed to support various configurations and evolving system requirements, making it easier for engineers to design for future storage demands.
Data Rate (Ethernet) | PCIe Generation | Impedance | Application Orientation | Differential Pairs/in² | |
---|---|---|---|---|---|
Impact Backplane Connectors | Up to 25 Gbps | PCIe Gen 4 | 85, 100 Ohms | Backplane, Coplanar, Daughtercard, Orthogonal, Orthogonal Direct, Orthogonal Midplane | 80 |
Impact zX2 Backplane Connectors | 25 to 28 Gbps | PCIe Gen 4 | 95, 100 Ohms | Backplane, Coplanar, Daughtercard, Orthogonal, Orthogonal Direct, Orthogonal Midplane | 80 |
Impel Plus Backplane Connectors | 56 Gbps | PCIe Gen 5 | 90 Ohms | Daughtercard, Coplanar, Vertical header, Cable | 48 to 192 |
Impulse Backplane Connectors | 112 Gbps | 90 Ohms | Backplane, Daughtercard, Orthogonal Direct | 101 |
Memory Sockets
When scaling server capabilities and enhancing system performance, memory sockets play a critical role. These components must operate effectively within space-constrained environments, allowing servers to adapt and expand as needed. Molex designs memory sockets with a reduced footprint and lower seating plane, optimizing both PCB and vertical space.
Circuits | Standard | PCB Thickness | |
---|---|---|---|
DDR5 DIMM Connectors | 288 | JEDEC | 1.57 to 3.18mm |
DDR4 DIMM Connectors | 288 | JEDEC | 1.70, 1.80, 2.00, 2.36, 2.54mm |
External I/O Solutions
Data transfer rates continue to rise, requiring high-speed cabling and connectivity solutions — particularly for storage servers taking on increased density. Advanced external I/O solutions deliver fast, reliable data access across environments where space is at a premium. Molex’s External High-Speed Pluggable I/O solutions are supported by universal connectivity options and engineered to align with industry standards such as MSA, IEEE and SFF architectures for seamless compatibility and premium performance.
Data Rate (per Lane) | Aggregate Speed | External Cable | |
---|---|---|---|
OSFP Connector System | 56, 112, 224 Gbps | Up to 1600 Gbps | DAC, AOC, ACC/AEC |
QSFP-DD Connector System | 28, 56, 112 Gbps | Up to 800 Gbps | DAC, AOC, ACC/AEC |
CDFP Connector System | 16, 32, 64 Gbps | Up to 400 Gbps | DAC, AOC |
QSFP Connector System | 28, 56 Gbps | Up to 400 Gbps | DAC, AOC, ACC/AEC |
SFP-DD Connector System | 28, 56 Gbps | Up to 112 Gbps | DAC |
zSFP Connector System | 28, 56 Gbps | Up to 56 Gbps | DAC |
Ethernet Speed | Operating Temperature | |
---|---|---|
Modular Jacks | 10, 100, 1000 Mbps | -40 to +85°C |
Magnetic Jacks | 100, 1000 Mbps | -40 to +85°C |
Standards | |
---|---|
USB Connectors | USB Type-A, USB Type-B, USB Type-C, USB 4, USB 3.0 |
Power Solutions
Server storage systems must carefully manage power density: high-power solutions require both advanced cooling and durable materials, while low-power options need to maximize energy efficiency and conserve space. Molex offers a versatile range of high-performance power solutions that serve both high-current and low-power strategies. These solutions are designed to achieve optimal power densities, preserving PCB real estate while maintaining efficient and dependable system operation.
Current | Termination | Pin Size | |
---|---|---|---|
Sentrality Pin and Socket Interconnects | 75.0, 120.0, 200.0, 350.0A | Board-to-board, Busbar | 3.40, 6.00, 8.00, 11.00mm |
PowerPlane Busbar Connectors | 100.0A | Cable-to-busbar | |
EXTreme Power Products | 30.0 to 150.0A | Board-to-board |
Current | Termination | Contact Diameter | |
---|---|---|---|
SW1 Connectors | 120.0, 175.0, 300.0A | Board-to-board, Busbar | 6.00, 8.00, 11.00mm |
UltraWize Connectors | 225.0A | Cable-to-board | 8.00mm |