Storage Server Interconnect Solutions

Storage server infrastructure is expanding to keep up with the increasing demands on capacity from cutting edge applications like AI. System designers are seeking out new ways to achieve higher data transfer speeds, improve space utilization and reduce thermal loads. Innovative storage server interconnect solutions from Molex offer superior signal integrity, versatile and compact form factors and effective thermal management, helping ensure long-term reliability and future scalability. 

Boosting Performance in Storage Server Connectors


Designers of high-performance storage servers – particularly in real-time environments – achieve the best data transfer rates through a strategy of maximizing signal integrity and minimizing latency. This optimization effort leads to the dual challenges of increasing storage density within confined spaces and the significant thermal loads that come with higher storage capacities.

In order to resolve these issues, engineers can leverage high-speed interfaces such as Non-Volatile Memory Express (NVMe), Peripheral Component Interconnect Express (PCIe), Serial Attach SCSI (SAS) and 100Gbps Ethernet, along with advanced interconnects such as NVMe over Fabrics (NVMe-oF) and direct-attached storage solutions. These technologies boost data transfer speeds and ensure low-latency pathways to maintain real-time data access. Future-proof storage solutions that optimize PCB space utilization and incorporate advanced thermal management techniques allow systems to scale without jeopardizing hardware performance.

Molex helps designers overcome these challenges with high-speed server storage interconnects engineered for superior signal integrity, meeting the latest industry performance standards like PCIe Gen 5 and Gen 6. Versatile form and function provide the flexibility needed to maximize space without compromising performance. Featuring low mated heights and reduced footprints to enhance airflow and heat dissipation, Molex storage server connectivity solutions deliver superior thermal management.


High-Speed Internal I/O Connectors


When designing internal I/O connectivity solutions for storage servers, engineers encounter significant hurdles in preserving signal integrity and managing bandwidth. Reliable data transmission depends on the use of high-grade components, effective EMI shielding and sophisticated signaling methods. By reducing signal degradation, precision manufactured I/O connectors from Molex offer a dependable solution for high-performance storage server applications.

  PCIe Gen 4
 16 Gbps
PCIe Gen 5
 32 Gbps
PCIe Gen 6
 64 Gbps
PCIe Gen 7
 128 Gbps
Standard
NextStream Connector System     x x SFF-TA-1035
NearStack PCIe Connector System   x x   SFF-TA-1026
NearStack HD Connector System   x x    
KickStart Connector System   x x   SFF-TA-1036
Multi-Trak I/O Connectors   x x   SFF-TA-1033
SAS Connector System x x     SFF-TA-8639
Sliver Edge Card Connectors

x

x

    SFF-TA-1002

Backplane Connectors


As data rates soar beyond 25Gbps per lane and latency requirements become stricter, backplane connectors must keep pace with the latest industry standards including PCIe 4.0, PCIe 5.0 and the upcoming PCIe 6.0. Molex addresses these challenges with innovative backplane connectors that offer superior performance, minimizing insertion loss while maintaining optimal signal integrity. Scalable and modular designs provide the flexibility needed to support various configurations and evolving system requirements, making it easier for engineers to design for future storage demands.

  Data Rate (Ethernet) PCIe Generation Impedance Application Orientation Differential Pairs/in²
Impact Backplane Connectors Up to 25 Gbps PCIe Gen 4 85, 100 Ohms Backplane, Coplanar, Daughtercard, Orthogonal, Orthogonal Direct, Orthogonal Midplane 80
Impact zX2 Backplane Connectors 25 to 28 Gbps PCIe Gen 4 95, 100 Ohms Backplane, Coplanar, Daughtercard, Orthogonal, Orthogonal Direct, Orthogonal Midplane 80
Impel Plus Backplane Connectors 56 Gbps PCIe Gen 5 90 Ohms Daughtercard, Coplanar, Vertical header, Cable 48 to 192
Impulse Backplane Connectors 112 Gbps   90 Ohms Backplane, Daughtercard, Orthogonal Direct 101

Memory Sockets


When scaling server capabilities and enhancing system performance, memory sockets play a critical role. These components must operate effectively within space-constrained environments, allowing servers to adapt and expand as needed. Molex designs memory sockets with a reduced footprint and lower seating plane, optimizing both PCB and vertical space. 

  Circuits Standard PCB Thickness
DDR5 DIMM Connectors  288 JEDEC 1.57 to 3.18mm
DDR4 DIMM Connectors 288 JEDEC 1.70, 1.80, 2.00, 2.36, 2.54mm

External I/O Solutions


Data transfer rates continue to rise, requiring high-speed cabling and connectivity solutions — particularly for storage servers taking on increased density. Advanced external I/O solutions deliver fast, reliable data access across environments where space is at a premium. Molex’s External High-Speed Pluggable I/O solutions are supported by universal connectivity options and engineered to align with industry standards such as MSA, IEEE and SFF architectures for seamless compatibility and premium performance. 

  Data Rate (per Lane) Aggregate Speed External Cable
OSFP Connector System 56, 112, 224 Gbps Up to 1600 Gbps DAC, AOC, ACC/AEC
QSFP-DD Connector System 28, 56, 112 Gbps Up to 800 Gbps DAC, AOC, ACC/AEC
CDFP Connector System 16, 32, 64 Gbps Up to 400 Gbps DAC, AOC
QSFP Connector System 28, 56 Gbps Up to 400 Gbps DAC, AOC, ACC/AEC
SFP-DD Connector System 28, 56 Gbps Up to 112 Gbps DAC
zSFP Connector System 28, 56 Gbps Up to 56 Gbps DAC
  Ethernet Speed Operating Temperature
Modular Jacks 10, 100, 1000 Mbps -40 to +85°C
Magnetic Jacks 100, 1000 Mbps -40 to +85°C
  Standards
USB Connectors USB Type-A, USB Type-B, USB Type-C, USB 4, USB 3.0

Power Solutions


Server storage systems must carefully manage power density: high-power solutions require both advanced cooling and durable materials, while low-power options need to maximize energy efficiency and conserve space. Molex offers a versatile range of high-performance power solutions that serve both high-current and low-power strategies. These solutions are designed to achieve optimal power densities, preserving PCB real estate while maintaining efficient and dependable system operation.

  Current Termination Pin Size
Sentrality Pin and Socket Interconnects 75.0, 120.0, 200.0, 350.0A Board-to-board, Busbar 3.40, 6.00, 8.00, 11.00mm
PowerPlane Busbar Connectors 100.0A Cable-to-busbar  
EXTreme Power Products 30.0 to 150.0A Board-to-board  
  Current Termination Contact Diameter
SW1 Connectors 120.0, 175.0, 300.0A Board-to-board, Busbar 6.00, 8.00, 11.00mm
UltraWize Connectors 225.0A Cable-to-board 8.00mm